Advanced Semiconductor Packaging Field Applications Engineer III, IV, or V
$84k/y-$140k/y
2 days ago
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RemoteFull-timeMid
Summary
Brewer Science, Inc. is seeking an Advanced Semiconductor Packaging Field Applications Engineer III, IV, or V to join their team remotely within the United States, preferably in Missouri or Arizona. The role involves providing on-site technical support, process optimization, and product integration expertise in the semiconductor industry.
About the Role
As an Advanced Semiconductor Packaging Field Applications Engineer, you will bridge advanced materials development with semiconductor customer needs. Your responsibilities will include supporting customer evaluations, operating application equipment, analyzing experimental data, collaborating with cross-functional teams, and leading complex product trials. You will also serve as the primary technical contact for multiple customer accounts and mentor junior engineers.
About You
Required:
- Bachelor's degree in chemical, electrical, or mechanical engineering or materials science with relevant experience (4+ years for III, 6+ years for IV, 8+ years for V).
- Experience with Advanced Semiconductor Packaging.
Preferred:
- Master's degree in a related field.
- Experience in leading major customer engagements and developing customer-specific strategies.
Benefits
- Medical, dental, vision, life, long- and short-term disability, identity theft protection, and pet insurance.
- Paid leave, including community service leave, wellness breaks, and other special leave.
- Employee stock ownership, 401k, and bonus plans.
- Educational assistance and employee assistance program.
Brewer Science
Brewer Science is a global technology leader in developing and manufacturing innovative materials, processes, and equipment for the reliable fabrication of cutting-edge microdevices used in electronics such as tablet computers, smartphones, digital cameras, televisions, and LED lighting. Since 1981, when our ARC® anti-reflective coatings revolutionized lithography processes, we have expanded our technology to include products used in advanced lithography, thin wafer handling, 3-D integration, chemical and mechanical device protection, and products based on carbon nanotubes and nanotechnology.
United States