Fab Module Engineer
$89k/y-$125k/y
Intel Corporationa day ago
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HybridFull-timeEntry
Summary
Intel is seeking a Fab Module Engineer to join their team in Hillsboro, OR. The role involves optimizing equipment and processes in semiconductor wafer processing and die-to-wafer assembly.
About the Role
As a Fab Module Engineer, you will be responsible for managing the 300mm toolsets related to thick metal/via layers, bumping, reflow, thinning, and backside metallization. Your duties will include ensuring safety and tool health, driving continuous improvement in tool performance, and collaborating with global partners to deliver high-quality products. You will also engage in module-level development, including defining roadmaps, conducting experiments, and resolving defect issues.
About You
Required:
- Master's Degree in an Engineering STEM related field (e.g., Electrical Engineering, Chemistry, Chemical Engineering, Mechanical Engineering, Material Science, Physics, Robotics, Molecular and Nanomaterials, Nanoengineering).
Preferred:
- Knowledge of statistics and experimental design.
- Strong data analysis and presentation skills.
- Technical and troubleshooting skills.
- Ability to work across organizational boundaries.
- Excellent teamwork and leadership skills.
Benefits
- Competitive pay and stock bonuses.
- Health, retirement, and vacation benefits.
- Hybrid work model allowing on-site and off-site work.
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone.
Hillsboro, OR