Intern - Package/Interposer Design (Summer 2026)
SK hynix AmericaHighlight
Summary
About the Role
About You
- Currently pursuing a Master's or PhD's degree in Electrical Engineering or a related field.
- Strong interest in signal integrity and power integrity fundamentals.
- Familiarity with package layout tools such as Cadence Allegro, Xpedition, or Autocad.
- Basic understanding of semiconductor packaging concepts and materials.
Benefits
- Housing allowance for eligible interns.
- Hands-on experience in advanced semiconductor packaging projects.
Semiconductors are essential to all IT products, and its performance often determines the performance of the final products. SK hynix is a global leader in producing semiconductor, such as DRAM, NAND Flash and CMOS Image Sensors. With these technology driven semiconductor products, SK hynix has consistently led the industry and is now the second largest memory chip maker worldwide. IT devices become more pervasive as new imaginative and innovative IT products continue to grab imagination and desires of consumers. SK hynix has enhanced its competency with the best level of technology and a wide range of business portfolios in order to satisfy all those demand from customers. As a member of SK Group*, SK hynix is aiming at becoming the world’s best semiconductor company. SK hynix America Inc. operates as a subsidiary of SK Hynix Inc. *SK Group is one of South Korea's top five industrial conglomerates. It has about 40 affiliated companies, ranging from energy, telecommunications, finance, to construction.