Intern, IC Packaging Thermal Analysis (Summer 2026)
SK hynix AmericaHighlight
Summary
About the Role
About You
- Currently pursuing a Master's or PhD's degree in Mechanical Engineering, Materials Science, or a related field.
- Strong interest in heat transfer, finite element analysis and its applications in semiconductor packaging.
- Strong problem-solving and analytical skills.
- Excellent communication and teamwork abilities.
- Currently pursuing a PhD's degree in Mechanical Engineering, Materials Science, or a related field.
- Familiarity with FEA software (e.g., FloTHERM, Icepak).
- Basic understanding of semiconductor packaging concepts and materials.
Benefits
- Eligible interns will receive a housing allowance during their internship.
Semiconductors are essential to all IT products, and its performance often determines the performance of the final products. SK hynix is a global leader in producing semiconductor, such as DRAM, NAND Flash and CMOS Image Sensors. With these technology driven semiconductor products, SK hynix has consistently led the industry and is now the second largest memory chip maker worldwide. IT devices become more pervasive as new imaginative and innovative IT products continue to grab imagination and desires of consumers. SK hynix has enhanced its competency with the best level of technology and a wide range of business portfolios in order to satisfy all those demand from customers. As a member of SK Group*, SK hynix is aiming at becoming the world’s best semiconductor company. SK hynix America Inc. operates as a subsidiary of SK Hynix Inc. *SK Group is one of South Korea's top five industrial conglomerates. It has about 40 affiliated companies, ranging from energy, telecommunications, finance, to construction.