Package Designer
21 hours ago
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OnsiteFull-timeSenior
Summary
Flux Computing is seeking a Senior / Staff ASIC Packaging Engineer to join their team in Austin, TX. The role involves leading the design, integration, and optimization of advanced multi-die packages for next-generation ultra-high-speed analog and mixed-signal ICs.
About the Role
As a Senior / Staff ASIC Packaging Engineer, you will be responsible for the physical implementation and signal integrity of complex packages, including flip-chip, 2.5D/3D ICs, and interposers. Your daily tasks will include developing detailed floorplans, collaborating with various teams to optimize chip/package interfaces, performing simulations, and driving package substrate design. You will also mentor junior engineers and partner cross-functionally with IC design, test, and manufacturing teams.
About You
Required:
- 7+ years of experience in ASIC/SoC packaging with a strong focus on multi-die integration.
- Proven track record in designing and shipping high-speed analog/RF and mixed-signal IC packages operating at 10 GHz and above.
- Deep understanding of package parasitics, high-density micro-bump routing, and thermal mitigation techniques.
Preferred:
- Experience with optical packaging, including co-packaged optics and silicon photonics integration.
- Expertise in signal and power integrity simulation tools and package design tools.
- Strong cross-functional communication skills.
Benefits
- Competitive salary and benefits package.
- Opportunities for professional development and mentorship.
Flux Computing
Flux Computing designs and manufactures optical processors to train and run inference on large AI models.
Austin, TX