Packaging Assembly Engineer
Applea day ago
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OnsiteFull-timeMid
Summary
Apple is seeking a Packaging Assembly Engineer to join their team in Austin, Texas. The role involves leading the development, optimization, and sustaining of advanced flip-chip BGA (FCBGA) assembly processes.
About the Role
As a Packaging Assembly Engineer, you will be responsible for defining and optimizing the end-to-end FCBGA assembly process flow, developing and maintaining process documentation, planning and executing experiments to improve yield and quality, and leading root-cause analysis for assembly issues. You will collaborate with cross-functional teams and support new product introduction builds while driving continuous improvement projects.
About You
Required:
- Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or a related field.
- 5+ years of experience in Semiconductor Packaging with knowledge of materials characterization and analysis.
Preferred:
- M.S. or PhD in a relevant field.
- Experience with large FCBGA packages, MCM packages, and 3D packaging technology.
- Strong communication skills and ability to work independently.
- Proficiency in package design software such as APD and Virtuoso.
Benefits
- Competitive salary and benefits package.
- Opportunities for professional development and career advancement.
Apple
We’re a diverse collective of thinkers and doers, continually reimagining what’s possible to help us all do what we love in new ways. And the same innovation that goes into our products also applies to our practices — strengthening our commitment to leave the world better than we found it. This is where your work can make a difference in people’s lives. Including your own. Apple is an equal opportunity employer that is committed to inclusion and diversity. Visit apple.com/careers to learn more.
Austin, Texas Metropolitan Area